Low Profile Copper Foil
LP Low Profile Electrodeposited Copper Foil
A transitional high-speed copper foil that first brought surface roughness down to the 3–4 μm level. With a fine equiaxed grain structure, it is the cost-effective choice for entering high-speed circuit applications.
· Product Features
- Rz 3–4 μm surface roughness
- Fine equiaxed grain morphology
- Df ≤ 0.01 dielectric loss
- ≤ 25 Gbps signal rate
Roughness Evolution Roadmap
Surface Roughness Evolution
Product Introduction
Product Introduction
LP (Low Profile) copper foil is a transitional product between standard foil (STD) and very low profile foil (VLP). Its hallmark is surface roughness reduced to the 3–4 μm level, about half that of STD foil.
The crystal structure of LP foil is fundamentally different: instead of the columnar crystals of conventional electrodeposited foil, it has fine equiaxed grains (grain size < 2 μm) with lamellar crystallization and flat ridges. This microstructural change brings several performance gains: significantly lower signal transmission loss, no copper powder transfer residue after etching, and better surface and insulation resistance.
For high-speed digital circuits running at 10–25 Gbps (such as gigabit Ethernet switches, industrial control mainboards and mid-range servers), LP strikes the best balance between performance and cost. Without the expensive processes required for VLP/HVLP, it already lowers Df from 0.015–0.020 for STD to the Low Loss level of 0.0065–0.01.
Key Process Characteristics
- Surface roughness Rz: 3–4 μm, about half that of STD foil
- Grain morphology: Fine equiaxed grains, non-columnar, grain size < 2 μm
- Typical Df: 0.0065 – 0.01 (Low Loss grade)
- Copper powder transfer: No residue after etching, better surface and insulation resistance
- Thermal stability: No copper recrystallization after multiple laminations
LP surface profile characteristics
Specifications
Available Specifications & Parameters
Multiple thickness grades covering every need from consumer electronics to industrial control.
Supply Format
- Rolls: width up to 1295 mm
- Sheets: up to 1295 × 1295 mm
Compatible Substrates
- Modified epoxy FR-4 (Mid-Loss / Low-Loss grade)
- BT resin
- CE copper clad build-up laminates
Applications
End-Use Applications
Serving every key sector of electronics manufacturing.
Network Communication Equipment
Gigabit / 10-gigabit Ethernet switches, industrial routers, mid-range network equipment
Mid-Range Servers
1U/2U rack server mainboards, storage controller cards
Automotive Electronics
Body control modules (BCM), in-vehicle infotainment (IVI) head units
HDI High-Density Interconnect
Outer layers of 6–8 layer HDI boards, fine lines at L/S = 50/50 μm and below
Industrial Control Equipment
PLC programmable logic controllers, DCS distributed control system mainboards
5G Small Cells
Indoor distributed antenna systems (DAS), micro base station RF front ends
Core Advantages
Core Product Advantages
Building differentiated competitiveness.
Cost-Effective High-Speed Solution
Low Loss signal performance at about 1.3–1.5 times the price of STD
No Copper Powder Transfer
Fine equiaxed grains eliminate copper powder residue after etching, improving insulation reliability
Precise Impedance Control
The flat surface keeps characteristic impedance deviation within ±8%
High Processing Yield
Fast etching with uniform side etching, significantly fewer white spot defects
Thermally Stable and Reliable
No copper recrystallization after multiple laminations, suitable for complex multilayer structures
Broad Substrate Compatibility
Good bonding with mainstream Mid-Loss and Low-Loss FR-4 laminates
Get LP Copper Foil Samples & Technical Data
Our technical team can recommend the optimal thickness grade and matching substrate for your specific application.