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HVLP hyper very low profile electrodeposited copper foil product illustration

Hyper Very Low Profile Copper Foil

HVLP Hyper Very Low Profile Electrodeposited Copper Foil

The smoothest surface among today's commercial copper foils, with Rz as low as 1–1.5 μm. Designed for mmWave above 28 GHz and ultra-high-speed interconnects in AI training clusters, it is a foundational material for the computing era.

· Product Features

  • Rz ≤ 1.5 μm lowest roughness
  • Df < 0.003 Ultra Low Loss
  • ≥ 56 Gbps ultra-high signal rate
  • HVLP-1~5 sub-grades
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Roughness Evolution Roadmap

Surface Roughness Evolution

STD
Standard foil
Rz 7–8μm
HTE
High-temp elongation
Rz 7–8μm
RTF
Reverse treated
Rz 4–6μm
LP
Low profile
Rz 3–4μm
VLP
Very low profile
Rz ≤2μm
HVLP
Hyper very low profile
Rz ≤1.5μm

Product Introduction

Product Introduction

HVLP (Hyper Very Low Profile) copper foil represents the highest level of today's commercial copper foil manufacturing. Building on VLP (Very Low Profile, Rz ≤ 2 μm), it pushes surface roughness further toward the physical limit, bringing Rz down to 1–1.5 μm or even lower (some HVLP-5 grades reach Rz ≤ 1.0 μm).

Why such an extremely smooth surface? The answer is the skin effect. At high frequencies (especially > 10 GHz), AC current does not flow evenly through the conductor cross-section but concentrates in a very thin "skin depth" layer at the surface; the higher the frequency, the shallower the skin depth. At 28 GHz mmWave, for example, the skin depth of copper is only about 0.4 μm. If the surface peaks and valleys (Rz) of the foil are much larger than the skin depth, current must "crawl" along a tortuous surface, greatly lengthening the effective path, sharply increasing resistance and severely attenuating the signal.

HVLP achieves a nearly atomically flat surface through tightly controlled electrodeposition parameters (ultra-low additive concentration, highly uniform current density and precise thermal field management). As a result, its insertion loss at 28 GHz and above is 60–70% lower than STD foil. As AI training clusters move to 56 Gbps / 112 Gbps SerDes rates and 5G-A / 6G mmWave commercialization accelerates, HVLP has become an irreplaceable strategic material.

Key Process Characteristics

  • Surface roughness Rz: 1.0 – 1.5 μm (HVLP-5 reaches ≤ 1.0 μm)
  • Sub-grades: Five grades: HVLP-1 / HVLP-2 / HVLP-3 / HVLP-4 / HVLP-5
  • Typical Df: < 0.003 (Ultra Low Loss grade)
  • Insertion loss @ 10 GHz: ≤ 0.35 dB/in, about 60% lower than STD
  • Frequency range: ≥ 28 GHz mmWave / 56–112 Gbps high-speed SerDes

HVLP ultimate roughness comparison

STD Rz 7–8μm
STD standard foil
High loss at high frequency
HVLP Rz ≤1.5μm ★
HVLP hyper very low profile
Nearly atomically smooth

Specifications

Available Specifications & Parameters

Five sub-grades covering the full high-speed spectrum from 25 Gbps to mmWave.

Model Nominal thickness Areal weight Surface roughness Rz Peel strength Typical applications
HVLP-1 12–35 μm On request ≤ 1.5 μm ≥ 0.8 kg/cm Entry-level high-speed boards (25–28 Gbps)
HVLP-2 12–35 μm On request ≤ 1.4 μm ≥ 0.85 kg/cm High-speed backplanes (28–56 Gbps)
HVLP-3 12–35 μm On request ≤ 1.3 μm ≥ 0.9 kg/cm AI server mainboards (56 Gbps SerDes)
HVLP-4 12–35 μm On request ≤ 1.2 μm ≥ 0.9 kg/cm AI training clusters, 112 Gbps interconnects
HVLP-5 12–18 μm On request ≤ 1.0 μm ≥ 0.85 kg/cm mmWave (≥ 28 GHz), cutting-edge 6G research

Supply Format

  • Rolls: width up to 1295 mm
  • Sheets: up to 1295 × 1295 mm
  • HVLP-4/5 by advance order, lead time 4–6 weeks

Compatible Substrates

  • PTFE (Ultra Low Loss grade)
  • Hydrocarbon resin (Df < 0.003)
  • Modified PPE/PPO, LCP liquid crystal polymer

Applications

End-Use Applications

Serving every key sector of electronics manufacturing.

AI Servers & Computing Clusters

GPU accelerator cards, TPU/NPU training boards, 56–112 Gbps SerDes high-speed interconnects

5G-A / 6G mmWave

28/39/77 GHz mmWave antenna modules, phased array radar transceiver units

Satellite Communications & Radar

Satellite-borne phased arrays, satellite internet ground stations, military electronic warfare systems

Ultra-High-Speed Switches

400GE / 800GE switch backplanes, co-packaged optics (CPO) substrates

Advanced Packaging

Redistribution layers (RDL) in 2.5D/3D IC packaging, conductive layers on glass substrates

Automotive mmWave

77 GHz mmWave radar PCBs, LiDAR control boards

Core Advantages

Core Product Advantages

Building differentiated competitiveness.

1

Industry's Lowest Roughness

Rz ≤ 1.5 μm (HVLP-5 reaches ≤ 1.0 μm), approaching the physical limit

2

Ultra-Low Signal Loss

Df < 0.003, with insertion loss 60%+ lower than STD

3

Supports 112 Gbps+

Meets the demanding requirements of next-generation AI computing and 6G mmWave

4

Five-Grade Selection

HVLP-1 to HVLP-5 precisely matched to different frequencies and cost budgets

5

Compatible with Top Substrates

Validated on ultra-low-loss substrates including PTFE, hydrocarbon resin and LCP

6

Strategically Scarce Resource

Global capacity is limited, and leading manufacturers have secured long-term supply

Get HVLP Copper Foil Samples & Technical Data

Our technical team can recommend the optimal thickness grade and matching substrate for your specific application.