High-Temperature Ductility Copper Foil
HTE High Temperature Elongation Electrodeposited Copper Foil
A specialty copper foil that retains excellent elongation at 180°C. Designed for multilayer PCB lamination, it effectively prevents "copper cracks" in inner-layer circuits and is one of the high-end copper foil categories with the largest market share in China.
· Product Features
- Elongation ≥ 30% at 180°C
- Rz 7–8 μm surface roughness
- 12–105 μm thickness range
- IPC-4562 international certification
Roughness Evolution Roadmap
Surface Roughness Evolution
Product Introduction
Product Introduction
HTE (High Temperature Elongation) copper foil, also known as HD (High Ductility) foil, is a specialty electrodeposited copper foil designed for multilayer PCB lamination. Its defining property: at 180°C it retains elongation of no less than 30% of its room-temperature value.
Multilayer PCB lamination involves sustained high temperatures (typically 170–190°C). At these temperatures, standard copper foil recrystallizes, causing grain coarsening and a sharp drop in ductility. When the elongation of inner-layer foil cannot withstand thermal expansion stress, microcracks form near corners or vias in inner-layer circuits. Known as "copper cracks", this is one of the most common reliability failure modes in multilayer boards.
Through a special alloy design (trace additions of Zn, Sn, Ag and other elements) and optimized electrodeposition/annealing processes, HTE foil retains enough plastic deformation capacity at high temperature to eliminate copper cracking at the source. HTE is now the standard material for multilayer boards with 8 or more layers, high-Tg laminates and automotive electronics PCBs.
Key Process Characteristics
- Elongation at 180°C: ≥ 30% of room-temperature elongation; some grades exceed 50%
- Tensile strength: ≥ 35 kg/mm² at room temperature, with little strength loss at high temperature
- Undercut resistance: Better than STD standard foil, with excellent chemical etching resistance
- Grain structure: Stable recrystallized structure after special heat treatment
HTE vs STD high-temperature elongation comparison
Specifications
Available Specifications & Parameters
A complete thickness range from standard to extra-thick, meeting multilayer board requirements for different layer counts and Tg levels.
Supply Format
- Rolls: width up to 1295 mm
- Sheets: up to 1295 × 1295 mm
- Slitting to customer-specified widths available
Quality Certifications
- IATF 16949 automotive quality management system
- ISO 9001 quality management system certification
- Compliant with IPC-4562 specification for electrodeposited copper foil
- Compliant with GB/T 5230-2020 national standard
Applications
End-Use Applications
Serving every key sector of electronics manufacturing.
AI Servers & Data Centers
High-layer-count backplanes (12–24 layers); HTE ensures inner-layer integrity through multiple lamination cycles
Automotive Electronics
ECU control boards, ADAS main control boards, BMS boards, meeting automotive-grade reliability requirements
Defense & Aerospace
High-layer-count high-frequency radar boards and satellite communication terminals, with structural stability under extreme temperature cycling
Network Communication Equipment
Core routers and high-speed switch backplanes; the mainstream choice for boards with 16+ layers
IC Packaging & Substrates
Core material for substrate-like PCBs (SLP) and FC-BGA substrates, ensuring package reliability
HDI High-Density Interconnect
Any-layer interconnect boards with 8+ layers; inner-layer foil for build-up multilayer boards
Core Advantages
Core Product Advantages
Building differentiated competitiveness.
No Embrittlement at High Temperature
Retains 30%+ of room-temperature elongation at 180°C, eliminating inner-layer copper cracks in multilayer boards
Excellent Tensile Strength
Room-temperature tensile strength ≥ 35 kg/mm², with far less high-temperature strength loss than STD foil
Strong Undercut Resistance
Optimized alloy composition improves chemical etching resistance for more uniform side etching
Automotive-Grade Reliability
AEC-Q200 certified, operating across the full -55°C to +150°C temperature range
Wide Thickness Coverage
Complete 12–105 μm range plus extra-thick grades up to 420 μm, all from one supplier
Controlled Cost
Meets the mechanical demands of multilayer boards at a more reasonable cost than VLP/HVLP
Get HTE Copper Foil Samples & Technical Data
Our technical team can recommend the optimal thickness grade and matching substrate for your specific application.