Product Story
Every Connection Free from Oxidation and Cold Joints
In electronics manufacturing and battery assembly, copper surface oxidation is the hidden culprit behind cold joints and poor contact. Copper foil stored in air for a few weeks can develop an oxide film that makes solder hard to wet and raises contact resistance, eventually leading to connection failures that are difficult to trace. In humid or sulfur-containing environments, exposed copper also gradually corrodes and discolors, directly affecting long-term reliability.
CIVEN tin-plated copper foil was developed to solve exactly this problem. High-quality rolled copper foil forms the conductive core and carries most of the current and heat; a dense, pure tin protective layer is applied on the surface by precision electroplating. The tin layer not only seals the copper off from the atmosphere but also quickly forms a reliable alloy bond with solder, making every joint stable, bright and repeatable.
Compared with nickel or silver plating, the biggest advantage of tin plating is "solder-friendliness at a balanced cost": tin is inherently compatible with mainstream solders (leaded Sn-Pb, lead-free SAC305, low-temperature solder paste), with fast wetting, large spread area and a wide process window, all without costly precious metals, making it a highly cost-effective solderable coating.
Total thickness ranges from 6 to 150 microns, with widths up to 600 mm. From ultra-thin battery tabs to thicker busbars and shielding layers, one material covers many applications. Customers can source multiple specifications from a single supplier, greatly simplifying supply chain management and reducing the risk of quality variation.