Product Story
Making Every Solder Joint a Reliable, Permanent Connection
In battery manufacturing and electronic assembly, solder quality directly determines product safety and service life. A cold joint might slip through factory testing yet become a critical open-circuit risk after tens of thousands of thermal cycles; a poorly wetted, oxidized joint can gradually degrade in humid conditions and eventually cause an entire module to fail.
CIVEN solderable nickel-plated copper foil was developed to solve exactly this problem. High-quality rolled copper foil forms the conductive core and carries most of the current and heat; a nickel protective film optimized for soldering is applied on the surface by precision electroplating. This nickel layer not only provides excellent solderability but also prevents copper oxidation during storage and processing, ensuring full, bright and reliable joints every time.
Unlike anti-corrosion nickel-plated copper foil, the solderable version's design philosophy focuses on "interface friendliness": plating thickness is usually kept in the thinner 0.1–1.5 micron range, providing enough oxidation protection without significantly affecting overall resistivity. More importantly, the nickel undergoes a special surface activation treatment that gives a very small wetting angle with mainstream solders (Sn-Pb, SAC305, lead-free solder paste, etc.), a large spread area and high joint strength.
Total thickness ranges from 12 to 150 microns, with widths up to 600 mm. From ultra-thin battery tabs to thicker module busbars, one material covers many applications. Customers can source multiple specifications from a single supplier, greatly simplifying supply chain management and reducing the risk of quality variation.